StarTech.com Thermal Paste, Metal Oxide Compound, Re-sealable Syringe (1.5g), CPU Heat Sink Thermal Grease Paste

. The StarTech.com Thermal Paste is designed for use in CPU heat sinks to enhance thermal performance. It features a high thermal conductivity of 1.93 W/m·K, ensuring efficient transfer of heat from components to the heatsink surface.

The product’s specific gravity is 1.7 g/cm³, providing good adhesion properties that help maintain consistent contact between the paste and the surfaces it contacts. This metal oxide compound also has excellent stability over operating temperatures ranging from -30 to +180 degrees Celsius, making it suitable for various environments including extreme conditions.

Additionally, its low thermal resistance of 0.12 °C/W ensures minimal temperature rise across the system when used effectively. The re-sealable syringe packaging allows precise application without waste, while maintaining sterility during storage. Compliance with RoHS standards indicates environmental friendliness in manufacturing processes.

Main characteristics

• Model: StarTech.com Thermal Paste, Metal Oxide Compound, Re-sealable Syringe (1.5g), CPU Heat Sink Thermal Grease Paste
• Colour: Silver
• Weight: 4 g
• Width: 20 mm
• Depth: 67 mm
• Package weight: 17 g
• sku: SILVGREASE1
• Type: Thermal paste